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US 6,485,197 B1Granted
Optical semiconductor module and process for producing the same
AssigneeNEC Corporation
InventorHidenori Kato
Life of this patent
Estimating the term…
Abstract
An optical semiconductor module has a housing having an opening, and an optical semiconductor element is set in the housing. An optical fiber that penetrates the opening is disposed. The optical fiber is allowed to perform optical transmission between the optical semiconductor element and elements arranged outside the housing. The opening is sealed with a photo-curing resin, and a transparent plate is arranged between the photo-curing resin and the outside of the housing.
Claims12
An optical semiconductor module comprising:
- a housing having an opening;
- an optical semiconductor element provided in said housing;
- an optical fiber that penetrates said opening, said optical fiber performing optical transmission between said optical semiconductor element and an element arranged outside said housing;
- photo-curing resin sealing said opening;
- and
- a transparent plate arranged between said photo-curing resin and the outside of said housing.
3 more elements
A process for producing an optical semiconductor module, comprising the steps of:
- putting an optical semiconductor element inside a case;
- arranging an optical fiber in said case, said optical fiber performing optical transmission between said optical semiconductor element and an element arranged outside said case;
- providing photo-curing resin to areas where side walls of said case and said optical fiber cross each other;
- putting a transparent plate on said photo-curing resin;
- and
- radiating light onto said photo-curing resin through said transparent plate to cure said photo-curing resin.
3 more elements
Dependencies are inferred from the claim text.