Method and apparatus for balling and assembling ball grid array and chip scale array packages

A method for attaching conductive material to conductive pads on one side of a substrate and for attaching a semiconductor chip to the other side of said substrate, the method comprising the steps of:

• providing a plate having pockets;
• placing the conductive material into said pockets;
• placing the substrate onto said plate so that said conductive pads are aligned with corresponding pockets;
• placing said semiconductor chip onto the other side of said substrate;
• simultaneously heating said plate, conductive material, substrate, and semiconductor chip;
• and
• wherein the step of placing the substrate onto the plate includes the substeps of placing at least one marking onto the plate, and using the marking on the plate to align the conductive pads on the substrate with the selected pockets on the plate.

A method for attaching conductive material to conductive pads on one side of a substrate and for attaching a semiconductor chip to the other side of said substrate, the method comprising the steps of:

• providing a plate having pockets;
• placing the conductive material into said pockets;
• placing the substrate onto said plate so that said conductive pads are aligned with corresponding pockets;
• placing said semiconductor chip onto the other side of said substrate;
• simultaneously heating said plate, conductive material, substrate, and semiconductor chip;
• and
• wherein the step of placing the semiconductor chip onto the substrate includes the substeps of placing at least one marking onto the substrate, and using the marking on the substrate to align the conductive pads on the other side of the substrate with the solder bumps on the semiconductor chip.

A method for attaching conductive material to conductive pads on one side of a substrate and for attaching a semiconductor chip to the other side of said substrate, the method comprising the steps of:

• providing a plate having pockets;
• placing the conductive material into said pockets;
• placing the substrate onto said plate so that said conductive pads are aligned with corresponding pockets;
• placing said semiconductor chip onto the other side of said substrate;
• simultaneously heating said plate, conductive material, substrate, and semiconductor chip;
• and
• wherein the step of providing a plate having pockets further comprises the step of providing passageways in the plate configured to provide vacuum force to the conductive materials in the pockets.

A method for attaching conductive material to conductive pads on one side of a substrate and for attaching a semiconductor chip to the other side of said substrate, the method comprising the steps of:

• providing a plate having pockets;
• placing the conductive material into the pockets;
• applying a flux substance over the conductive material placed in the pockets of the plate;
• placing the substrate onto the plate so that the conductive pads are aligned with corresponding pockets;
• placing the semiconductor chip onto the other side of said substrate;
• and
• simultaneously heating the plate, conductive material, substrate, and semiconductor chip.

A method for attaching a semiconductor chip to a substrate comprising:

• providing a plate having at least one cylindrical pocket;
• placing solder paste into the pocket so as to form a substantially cylindrical solder paste structure;
• placing the substrate onto the plate so that a conductive pad on a first side of the substrate is aligned with the pocket;
• placing the semiconductor chip onto the substrate so that a solder bump on the semiconductor chip is aligned with a conductive pad on a second side of the substrate;
• and
• simultaneously heating the plate, the substantially cylindrical solder paste structure, the substrate, and the solder bump on the semiconductor chip so as to connect the semiconductor chip to the substrate.