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US 6,484,394 B1Granted
Encapsulation method for ball grid array semiconductor package
AssigneeHyundai Electronics Industries Co., Ltd.
InventorsSeong-Jae Heo, Chi-Jung Song
Life of this patent
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Abstract
An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.
Claims14
An encapsulation method for a ball grid array (BGA) semiconductor package, comprising:
- adhering adhesive tape to an upper portion of a printed circuit board on which wiring exists, thereby defining a cavity of a predetermined size between adjacent edges of pieces of the adhesive tape;
- positioning a mold on the printed circuit board to which the adhesive tape is adhered;
- injecting a liquid epoxy through a through hole of the mold to cover the upper portion of the printed circuit board which is exposed through the cavity with the liquid epoxy;
- and
- removing the mold and the adhesive tape.
2 more elements
An encapsulation method for a ball grid array semiconductor package, comprising:
- adhering adhesive tape to an upper portion of a printed circuit board on which wiring exists, thereby defining a cavity of a predetermined size between adjacent edges of pieces of the adhesive tape;
- surrounding the entire package including the adhesive tape with a mold;
- injecting a liquid epoxy through a through hole of the mold to cover the upper portion of the printed circuit board which is exposed through the cavity with the liquid epoxy;
- and
- removing the mold and the adhesive tape.
2 more elements
Dependencies are inferred from the claim text.