IC substrate noise modeling including extracted capacitance for improved accuracy
AssigneeSimplex Solutions, Inc.
InventorJean-Michel Richer
Life of this patent
Estimating the term…
Loading patent…
AssigneeSimplex Solutions, Inc.
InventorJean-Michel Richer
Estimating the term…
A method for extracting the capacitance value associated with a PN junction along the well-substrate interface for use in modeling the substrate. The method includes receiving the 2-D or 1-D mesh doping profile. The method includes finding a junction curve or transition region that represents the transition between the well and the substrate bulk. The method further includes finding a set of parameters α,β and γ to characterize the junction at a point or a vertical discretization along the transition. During modeling, the set of parameters α, β and γ is then employed, along with the input bias voltage value, to calculate the thickness of the depletion region, which is in turn employed to calculate the capacitance for the well-substrate junction. The capacitance calculated is then employed to more accurately model the junction, which leads to a more accurate model for the substrate.
A method for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
A method for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
A method for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
A computer readable medium for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising the following instructions:
An apparatus for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
A computer readable medium for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising the following instructions:
An apparatus for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
A computer readable medium for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising the following instructions:
An apparatus for performing surface modeling of a substrate for the purpose of characterizing the substrate, comprising:
Dependencies are inferred from the claim text.