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US 6,480,396 B2Granted
Printed circuit board and electronic equipment using the board
AssigneeKabushiki Kaisha Toshiba
InventorRyoji Ninomiya
Life of this patent
Estimating the term…
Abstract
An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.
Claims5
A printed circuit board comprising:
- a ground layer;
- an insulation layer provided on the ground layer;
- a signal line provided on the insulation layer, the signal line being exposed;
- a power supply plane provided on the insulation layer, which feeds power to the signal line through a termination resistor;
- and
- a dielectric material which covers the power supply plane, the dielectric material contacting a top surface and a side surface of the power supply plane, and contacting the insulation layer.
3 more elements
Dependencies are inferred from the claim text.