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US 6,480,395 B1Granted
Device and method for interstitial components in a printed circuit board
AssigneeHewlett-Packard Company
InventorDale R. Kopf
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.
Claims6
A printed circuit board, comprising:
- first, second, and third printed circuit board (PCB) substrate layers;
- an above-board device mounted on an outer surface of the first PCB layer;
- first and second interstitial layers disposed between said first and second PCB substrate layers and said second and third PCB substrate layers, respectively, said first and second interstitial layers comprising a dielectric compound that laminates bordering substrate layers;
- a first interstitial component having a lead, securely disposed in the first interstitial layer and a second interstitial component securely disposed in the second interstitial layer;
- and
- a via electrically connecting at least two of said PCB substrate layers.
3 more elements
Dependencies are inferred from the claim text.