Hard disk drive suspension with integral flexible circuit

A circuit assembly for a disk suspension assembly, comprising:

• a base member;
• a plurality of traces formed directly on a first surface of the base member, the traces extending between a first end and a second end of the base member;
• a reference voltage layer formed directly on a second surface of th base member, the plurality of traces overlaying at least a portion of the reference voltage layer;
• and
• a support member formed directly on at least a portion of the reference voltage layer, wherein the support member includes a first portion having a first thickness and a second portion having a second thickness, the second thickness being substantially greater the first thickness.

A circuit assembly for a disk suspension assembly, comprising:

• a base member;
• a plurality of traces formed directly on a first surface of the base members, the traces extending between a first end and a second end of the base member;
• a reference voltage layer formed directly on a second surface of the base member, the plurality of traces overlaying at least a portion of the reference voltage layer;
• and
• a support member formed directly on at least a portion of the reference voltage layer, wherein the support member is formed from a material having a tensile strength of greater than about 90,000 psi and wherein the ground plane is formed from a material having a tensile strength of less than about 60,000 psi.

A circuit assembly for a disk suspension assembly, comprising:

• a base member;
• a plurality of traces formed directly on a first surface of the base member, the traces extending between a first end and a second, end of the base member;
• a reference voltage layer formed directly on a second surface of the base member, the plurality of traces overlaying at least a portion of the reference voltage layer, and
• a support member formed directly on at least a portion of the reference voltage layer,
• wherein the support member includes a load beam portion and a head gimbal portion, wherein the load beam portion includes flange portions having a first thickness and the gimbal portion has a second thickness, the first thickness being substantially greater than e second thickness.

A process for making a circuit assembly for a disk suspension assembly, comprising the steps of:

• forming a plurality of traces directly on a first surface of a base member wherein the traces end between a first end and a second end of the base member;
• forming a reference voltage layer directly on a second surface of the base member wherein the plurality of traces overlay at least a portion of the reference voltage layer;
• and
• forming a support member directly on at least a portion of the reference voltage layer, wherein the step of forming the support member includes the steps of forming a first portion of the support member to have a first thickness and forming a second portion of the support member to have a second thickness wherein the second thickness is substantially greater than the first thickness.

A disk drive suspension assembly, comprising:

• an elongated polymeric base member;
• a plurality of traces formed directly on a first surface of the base member;
• a reference voltage layer formed directly on a second surface of the base member, the reference voltage layer formed from a first electrically conductive material and the plurality of traces overlaying at least a portion of the reference voltage layer;
• and
• a support member formed directly on at least a portion of the reference voltage layer, the support member formed from a second electrically conductive material, the first electrically conductive material providing substantially greater electrical conductivity and substantially lower tensile strength than the second electrically conductive material, the support member including a head gimbal portion having a first thickness and a flange portion having a second thickness, the second thickness being substantially greater than the first thickness.