High density, high frequency memory chip modules having thermal management structures

A method for assembling a high-density memory module, the steps comprising:

• a) attaching a plurality of memory devices to at least one daughter card having a plurality of pins along at least one edge thereof, said pins being respectively and operatively connected to said plurality of memory devices;
• b) providing a memory board having a plurality of plated through holes adapted to detachably receive and retain said plurality of pins therein, said pins thereby providing substantially all retentive forces needed to releasably retain said daughter card to said memory board;
• c) after said attaching step (a), testing each of said at least one daughter card connected to said memory board;
• d) detaching and replacing any daughter card failing said test performed in step (c);
• e) retesting said replaced daughter card;
• and
• f) repeating said detaching and rep lacing step (d) and said retesting step (e) until a completely functional memory module is obtained.