Probe card device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorJunko Komori
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Abstract
A probe card device having an insulator board and a plurality of bumps includes a probe card wafer formed of the same material as that of a wafer under test. Probe card wafer is provided with a spacer to seal between the wafer under test and probe card wafer in order to hold the wafer under test by vacuum, and a wafer through hole for evacuation. Thus, a probe card device having a probe card wafer which can be surely electrically connected with pads of a plurality of semiconductor devices formed in a semiconductor substrate under test can be provided.
Claims21
A probe card device for testing a plurality of semiconductor devices formed on a substrate under test, comprising:
- a probe substrate adapted to be provided opposing the substrate under test and formed of the same material as that of the substrate under test, said probe substrate having a plurality of probe electrodes adapted to be in electrical contact with the semiconductor devices,
- said probe substrate comprising:
- a first seal member provided on a surface of said probe substrate which opposes the substrate under test during testing to hold the substrate under test by vacuum and seal between the substrate under test and said probe substrate, wherein said first seal member is adapted to directly contact said substrate under test during testing;
- and
- a substrate through hole passed through said probe substrate for evacuation.
Dependencies are inferred from the claim text.