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US 6,479,893 B2Granted
Ball-less clip bonding
AssigneeSemiconductor Components Industries, LLC
InventorsSaat Shukri Embong, Chee Chew Hiong
Life of this patent
Estimating the term…
Abstract
A semiconductor component includes a semiconductor chip (120, 1120), an electrically conductive adhesive located over the semiconductor chip, and a clip bond (231, 232, 1231, 1232) located over the electrically conductive adhesive. The clip bond has at least one burr to retain the electrically conductive adhesive.
Claims3
A semiconductor component comprising:
- a lead frame;
- a semiconductor chip;
- a plurality of portions of solder located over and electrically coupled to the semiconductor chip and located over and electrically coupled to the lead frame;
- and
- a plurality of clip bonds located over and electrically coupled to the plurality of portions of the solder, each of the plurality of clip bonds having a plurality of burrs to retain the plurality of portions of the solder.
2 more elements
A semiconductor component comprising:
- a lead frame;
- a semiconductor chip;
- a plurality of portions of solder located over and electrically coupled to the semiconductor chip and located over and electrically coupled to the lead frame;
- a plurality of clip bonds located over and electrically coupled to the plurality of portions of the solder, each of the plurality of clip bonds having a plurality of burrs to retain the plurality of portions of the solder, wherein each of the plurality of clip bonds further comprises:
- a plurality of holes located over the solder, each of the plurality of holes having a perimeter,
- wherein:
- a plurality of the plurality of burrs of the clip bond are located adjacent to the perimeter of each of the plurality of holes of the clip bond,
- a first one of the plurality of portions of the solder is located over a first portion of the lead frame;
- a second one of the plurality of portions of the solder is located over a second portion of the lead frame;
- a third one of the plurality of portions of the solder is located over a first portion of the semiconductor chip;
- a fourth one of the plurality of portions of the solder is located over a second portion of the semiconductor chip;
- a first one of the plurality of holes of a first one of the plurality of clip bonds is located over the first one of the plurality of portions of the solder;
- a second one of the plurality of holes of the first one of the plurality of clip bonds is located over the third one of the plurality of portions of the solder;
- a first one of the plurality of holes of a second one of the plurality of clip bonds is located over the second one of the plurality of portions of the solder;
- and
- a second one of the plurality of holes of the second one of the plurality of clip bonds is located over the fourth one of the plurality of portions of the solder.
13 more elements
Dependencies are inferred from the claim text.