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US 6,479,886 B1Granted
Integrated circuit package with EMI shield
AssigneeIntel Corporation
InventorsSteven L. Pollock, Robert L. Olivier
Life of this patent
Estimating the term…
Abstract
An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a ground pin is electrically coupled to the semiconductor die, a ferrite bead is electrically coupled to the EMI shield and the ground pin, and a package body encapsulates the EMI shield.
Claims11
A packaged integrated circuit comprising:
- a substrate;
- a semiconductor die mounted to the substrate;
- an EMI shield that encapsulates the semiconductor die;
- a ground pin electrically coupled to the semiconductor die;
- a ferrite bead electrically coupled to the EMI shield and the ground pin;
- and
- a package body that encapsulates the EMI shield;
- wherein the EMI shield has substantially planar upper and lower surfaces and first, second, third and fourth side surfaces, those side surfaces each oriented substantially perpendicular to both the upper and lower surfaces, the first and second side surfaces each being substantially planar and oriented substantially perpendicular to the third and fourth side surfaces, the third and fourth side surfaces receiving a plurality of external pins;
- and
- wherein the third and fourth side surfaces each have a substantially jigsaw like configuration, in which indented portions alternate with extended portions, the indented portions each receiving an end of each of the plurality of external pins, and the extended portions penetrating between adjacent external pins a distance along the length of those pins.
7 more elements
A packaged integrated circuit comprising:
- a substrate;
- a semiconductor die mounted to the substrate;
- an EMI shield that encapsulates the semiconductor die, the EMI shield including a side surface having indented and extended portions;
- a plurality of external pins, each pin having an end that fits between a pair of the extended portions and within an indented portion;
- a ground pin electrically coupled to the semiconductor die;
- a ferrite bead electrically coupled to the EMI shield and the ground pin;
- and
- a package body that encapsulates the EMI shield.
5 more elements
A computer assembly comprising a packaged integrated circuit which comprises:
- a substrate;
- a semiconductor die mounted to the substrate;
- an EMI shield that encapsulates the semiconductor die;
- a ground pin electrically coupled to the semiconductor die;
- a ferrite bead electrically coupled to the EMI shield and the ground pin;
- and
- a package body that encapsulates the EMI shield;
- wherein the EMI shield includes a side surface that receives a plurality of external pins;
- and
- wherein the side surface has a substantially jigsaw like configuration, in which indented portions alternate with extended portions, the indented portions each receiving an end of each of the plurality of external pins, and the extended portions penetrating between adjacent external pins a distance along the length of those pins.
7 more elements
Dependencies are inferred from the claim text.