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US 6,479,878 B1Granted
Semiconductor device and semiconductor electret condenser microphone
AssigneeSanyo Electric Co., Ltd.
InventorsShigeaki Okawa, Toshiyuki Ohkoda, Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Shuji Osawa
Life of this patent
Estimating the term…
Abstract
A stationary electrode layer 12 is formed on a semiconductor substrate 11, and a vibrating diaphragm 16 is disposed on spacers 14. The vibrating diaphragm 16 is placed so as to protrude from an end of the semiconductor substrate 11, and terminal pads 20 to 23 are placed with being exposed from the vibrating diaphragm 16.
Claims17
A semiconductor device comprising:
- a semiconductor substrate in which electronic circuits are integrated;
- a stationary electrode layer disposed on a surface of said semiconductor substrate;
- and
- a spacer disposed around said stationary electrode layer for disposing a vibrating diaphragm that is to be separated from said stationary electrode layer,
- wherein said spacer is placed to allow said vibrating diaphragm to partly protrude from an end of said semiconductor substrate.
2 more elements
A semiconductor electret condenser microphone comprising:
- a semiconductor substrate in which electronic circuits are integrated;
- a stationary electrode layer disposed on a surface of said semiconductor substrate;
- a spacer disposed around said stationary electrode layer;
- and
- a vibrating diaphragm disposed on said spacer, said vibrating diaphragm disposed to partly protrude from an end of said semiconductor substrate.
2 more elements
A semiconductor electret condenser microphone comprising:
- a semiconductor device including a stationary electrode layer formed on a surface of a semiconductor substrate, plural spacers disposed in a periphery of said stationary electrode layer, and a vibrating diaphragm disposed on said spacers;
- and
- a hollow package in which said semiconductor device is mounted,
- wherein a side face of said semiconductor substrate is separated from said package to allow a space formed therebetween to communicate with a space below said vibrating diaphragm via gaps between said spacer.
1 more element
A semiconductor device comprising:
- a semiconductor substrate;
- electronic circuits integrated in said semiconductor substrate;
- an electrode layer disposed on said semiconductor substrate;
- a spacer disposed on said electrode layer;
- and
- a vibrating diaphragm disposed on said spacer, said vibrating diaphragm partly protruding from an end of said semiconductor substrate.
3 more elements
Dependencies are inferred from the claim text.