Single supply HFET with temperature compensation
AssigneeMotorola, Inc.
InventorsJenn-Hwa Huang, Elizabeth C. Glass, Olin Hartin, Wendy L. Valentine, Julio Costa
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AssigneeMotorola, Inc.
InventorsJenn-Hwa Huang, Elizabeth C. Glass, Olin Hartin, Wendy L. Valentine, Julio Costa
Estimating the term…
A method of fabricating apparatus, and the apparatus, for providing low voltage temperature compensation in a single power supply HFET including a stack of epitaxially grown compound semiconductor layers with an HFET formed in the stack. A Schottky diode is formed in the stack adjacent the HFET during the formation of the HFET. The HFET and the Schottky diode are formed simultaneously, with a portion of one of the layers of metal forming the gate of the HFET being positioned in contact with a layer of the stack having a low bandgap (e.g. less than 0.8 eV) to provide a turn-on voltage for the Schottky diode of less than 1.8 Volts. The Schottky diode is connected to the gate contact of the HFET by a gate circuit to compensate for changes in current loading in the gate circuit with changes in temperature.
Apparatus for providing low voltage temperature compensation in a single power supply hetero-junction field effect transistor comprising:
An apparatus for providing low voltage temperature compensation in a single power supply hetero-junction field effect transistor comprising:
Dependencies are inferred from the claim text.