Radiation—and/or heat-curable adhesive having high thermal conductivity
AssigneeRobert Bosch GmbH
InventorsGerhard Liebing, Volker Brielmann, Achim Battermann, Juergen Perl
Life of this patent
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Abstract
A radiation—and/or heat-curable adhesive with high thermal conductivity includes the following recipe: 19 to 40 wt % of a difunctional acrylated, aromatic polyurethane; 9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate; 1 to 5 wt % of one or more photoinitiators; 35 to 70 wt % of one or more mineral fillers; 0.5 to 3 wt. % of an SiO2-containing thixotropizing agent; and 0.5 to 2 wt % of an organic peroxide.
Claims13
A radiation—and/or heat-curable adhesive composition having high thermal conductivity, comprising:
- 19 to 40 wt % of a difunctional acrylated, aromatic polyurethane;
- 9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate;
- 1 to 5 wt % of one or more photoinitiators;
- 35 to 70 wt % of one or more mineral fillers;
- 0.5 to 3 wt. % of an SiO2-containing thixotropizing agent;
- 0.5 to 2 wt % of an organic peroxide;
- and spherical spacers.
A radiation—and/or heat-curable adhesive composition having high thermal conductivity, comprising:
- 23 to 26 wt % of a difunctional acrylated, aromatic polyurethane;
- 13 to 16 wt % of (2-hydroxypropyl) acrylate or methacrylate;
- 2 to 3 wt % of one or more photoinitiators;
- 52 to 60 wt % of one or more mineral fillers;
- 1 to 2 wt. % of an SiO2-containing thixotropizing agent;
- and 1 to 1.5 wt % of an organic peroxide.
A method of bonding electronic components or circuits to heat sinks comprising the step of applying an adhesive composition having high thermal conductivity;
- 19 to 40 wt % of a difunctional acrylated, aromatic polyurethane;
- 9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate;
- 1 to 5 wt % of one or more photoinitiators;
- 35 to 70 wt % of one or more mineral fillers;
- 0.5 to 3 wt. % of an SiO2-containing thixotropizing agent;
- 0.5 to 2 wt % of an organic peroxide;
- and spherical spacers.
Dependencies are inferred from the claim text.