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AssigneeHewlett-Packard Company
InventorsJeffrey P Witte, Daniel J Dixon
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A method and system for performing in-place insertion of interconnect repeaters in an integrated circuit is presented. The integrated circuit comprises a silicon layer and at least one interconnect layer layered over said silicon layer. Metal tracks are reserved on each of the interconnect layers in predefined repeater areas. The interconnects are then routed to pass over the pre-defined repeater areas. For each interconnect, a set of optimal constrained repeater locations are calculated, as defined by the optimal number and locations of repeaters along the interconnect route and as constrained by a set of legal repeater locations associated with the interconnect and which will result in acceptable timing criteria. For each calculated optimal constrained repeater location, a repeater is stitched in-place through the reserved metal tracks of the intervening layers.
An in-place method for inserting interconnect repeaters in an integrated circuit, said integrated circuit comprising a silicon layer, an interconnect layer layered over said silicon layer, and zero or more intervening layers layered between said interconnect layer and said silicon layer, said method comprising the steps of:
A system for performing in-place insertion of interconnect repeaters in an integrated circuit, said integrated circuit comprising a silicon layer, an interconnect layer layered over said silicon layer, and zero or more intervening layers layered between said interconnect layer, said integrated circuit comprising a set of predefined legal repeater location areas and metal reserved on each layer for connecting repeaters implemented on said silicon layer to interconnects passing over said set of predefined legal repeater location areas, said system comprising:
Dependencies are inferred from the claim text.