Method of embedding RAMS and other macrocells in the core of an integrated circuit chip
AssigneeNVIDIA U.S. Investment Company
InventorJohn C. Thomas
Life of this patent
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AssigneeNVIDIA U.S. Investment Company
InventorJohn C. Thomas
Estimating the term…
Macrocells, e.g., Random Access Memory (“RAM”), are arranged in columns and disposed in a core of an integrated circuit (IC) chip. The macrocells can abut each other within the columns or can be separated from each other by standard cells which are disposed to fill gaps between the macrocells within the columns. Power/ground rails are disposed vertically along the sides of the columns. The power/ground rails run the full height of the core and couple to a power/ground ring disposed along the perimeter of the core. The power/ground rails also couple to the macrocells and the standard cells and provide power to those cells. The columns can form right angles with horizontal standard cell rows, thus enabling the standard cells to couple easily to the vertically disposed power/ground rails.
A method of embedding and optimizing placement of macrocells in an integrated circuit core, comprising:
Dependencies are inferred from the claim text.