Microbench and producing method therefor, and optical semiconductor module using same
AssigneeSumitomo Electric Industries, Ltd.
InventorNobuyoshi Tatoh
Life of this patent
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Abstract
An object of the present invention is to produce and provide a microbench for achieving a highspeed, low-cost semiconductor module having a high S/N ratio. A microbench for use in mounting an optical fiber, is characterized in that a substrate comprises a ceramics having a specific resistance 109 Ωcm or larger and a dielectric constant of 15 or less, a groove for mounting an optical fiber is disposed on the surface thereof, a semiconductor device mounting portion onto which an optical semiconductor is mounted is provided at the end portion of this groove, and an alignment mark for semiconductor mounting is disposed in this semiconductor device mounting portion. The above-mentioned ceramics is either AlN, or a ceramics having AlN as its principal component.
Claims13
A microbench for use in mounting an optical fiber, comprising a substrate made of a ceramics having a specific resistance of 109 Ωcm or larger and a dielectric constant of 15 or less, wherein a groove for mounting an optical fiber is formed on the surface of the substrate, there is provided a semiconductor device mounting portion onto which an optical semiconductor device is mounted at the end portion of the groove, and an alignment mark for semiconductor device mounting is disposed in the semiconductor device mounting portion.
A microbench producing method comprising:
- providing a baked ceramics substrate;
- placing a die on the baked ceramics substrate, the die having configurations, wherein at least one shapes selected from a group of a groove for mounting an optical fiber, a semiconductor device mounting portion and an alignment mark is inverted;
- and
- re-baking the baked ceramics substrate at 1,400° C. or higher.
A microbench producing method comprising:
- preparing a ceramics sheet in which holes have been made in an optical fiber mounting portion and another ceramics sheet in which there are no holes;
- baking both ceramics sheets placed one on top of the other to prepare a ceramics having a groove;
- metallizing the surface thereof to form a metalic layer;
- inserting a metal chip into either said groove or a portion which will serve as a semiconductor device mounting portion, or both;
- and
- heating at a temperature of 150° C. or higher, while at the same time impressing the ceramics, so that an optical fiber mounting portion, a semiconductor mounting portion, and an alignment mark are formed in the ceramics.
Dependencies are inferred from the claim text.