Integrated circuit device package including multiple stacked components

An apparatus for electrically interconnecting a plurality of stacked electrical components including a land grid array integrated circuit device, a daughter card and a mother board, the daughter card having opposed, parallel, first and second major surfaces, the mother board having opposed, parallel, first and second major surfaces, said apparatus comprising:

• a land grid array on each of said first and second major surfaces of the daughter board electrically connected to electrical elements carried by the daughter board;
• a land grid array on the first major surface of the mother board electrically connected to electrical elements carried by the mother board;
• a first land grid array interposer socket and a second land grid array interposer socket, said first interposer socket enabling electrical connection between said land grid array integrated circuit device and the land grid array on the first major surface of the daughter card, and said second land grid array interposer socket enabling electrical connection between the land grid array on the second major surface of the daughter card and the land grid array on the mother board;
• a clamping plate for overlying the integrated circuit device;
• and
• a clamping mechanism for compressively urging the integrated circuit device, said first interposer socket, said daughter card, said second interposer socket and said mother board into electrical interconnection under a predetermined load.

An integrated circuit device package comprising:

• a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board;
• a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of said first circuit board, wherein said second side of said first circuit board is opposite to and parallel with said first side of said first circuit board;
• and
• a clamping mechanism for compressively urging together said LGA integrated circuit device, said first LGA interposer socket, said first circuit board, said second LGA interposer socket, and said second circuit board into electrical interconnection under a predetermined load.