Multiple layer thin flexible circuit board
AssigneeDaimlerChrysler AG
InventorTina Barcley
Life of this patent
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Abstract
A printed circuit board, containing thermal pads, is adhered to a rigidizer plate whereupon the entire unit can then be bent over itself to create a compact assembly which can be substantially smaller, but contain the same number of traces and electrical components, as an unbent printed circuit board of the same surface area. Further, a complete housing assembly is formed which is sealed on each edge of the rigidizer by inserting the edge into a panel with a groove. This assembly provides a secure fit that provides great stability with a relatively low weight and volume. The assembly also provides a better RF non-mechanical connection and much better thermal performance.
Claims17
A circuit board assembly comprising:
- a flexible printed circuit board having first and second sides;
- a rigidizer having first and second sides;
- a thermally conductive adherent, comprising a liquid containing spacing beads, for adhering at least a portion of said second side of said flexible printed circuit board to said first side of said rigidizer;
- and
- an electrically conductive screen disposed in the adherent and between a portion of said second side of said flexible circuit board and said first side of said rigidizer.
The circuit board assembly of claim 6, wherein the thermally conductive material comprises said thermally conductive adherent.
Dependencies are inferred from the claim text.