Interposer substrate with low inductance capacitive paths
AssigneeIntel Corporation
InventorsKishore K. Chakravorty, Michael Walk
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsKishore K. Chakravorty, Michael Walk
Estimating the term…
A thin film capacitor provides an interposer substrate between an integrated circuit die and an organic substrate. The interposer substrate includes a first conductive layer deposited on a base substrate layer. A portion of the first conductive layer provides a first electrode region serving as a first plate of the capacitor. Portions of a second conductive layer forming a second electrode region serving as a second plate of the capacitor. A dielectric layer is disposed between the first and second conductive layers to provide for capacitive regions between the first electrode region and the second electrode region. The base substrate layer and die may be based on similar semiconductor materials, such as Silicon or Gallium Arsenide, to provide an improved coefficient of thermal expansion match.
An interposer substrate for mounting a die to a circuit board comprising:
A capacitor having conductive paths therethrough and providing capacitance between at least two of the conductive paths, the capacitor comprising:
A capacitor having conductive paths therethrough and providing capacitance between at least two of the conductive paths, the capacitor comprising:
A multilayer capacitor having conductive paths therethrough and providing capacitance between at least two of the conductive paths, the multilayer capacitor comprising:
Dependencies are inferred from the claim text.