Electronic component for high frequency signals and method for fabricating the same
AssigneeTDK Corporation
InventorKatsuhiko Hayashi
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Abstract
An electronic component for a high frequency signal having a good characteristics and a fabrication method thereof at a high yield are disclosed. The electronic component according to the present invention includes a conductive pattern, which works as a certain circuit element such as an inductor, formed on an insulating substrate. The conductive pattern has a dual structure including a first conductive pattern which is formed by means of the photolithography technique and a second conductive pattern entirely covering the first conductive pattern which is formed by means of an electroless plating method.
Claims34
An electronic component for high frequency signals comprising an insulating substrate and a conductive pattern formed on the insulating substrate, the conductive pattern having a dual structure including a first conductive element and a second conductive element, the second conductive element of the conductive pattern covering the first conductive element of the conductive pattern substantially entirely.
An electronic component for high frequency signals comprising an insulating substrate and a conductive pattern formed on the insulating substrate, the conductive pattern having a dual structure including a first element and a second element, the second element of the conductive pattern covering the first element of the conductive pattern substantially entirely, wherein the first element of the conductive pattern has a side wall and the second element of the conductive pattern has a dilated portion expanded outward from the side wall of the first element.
An electronic component for high frequency signals comprising an insulating substrate and a conductive pattern formed on the insulating substrate, the conductive pattern having a dual structure including a first element and a second element, the second element of the conductive pattern covering the first element of the conductive pattern substantially entirely, the electronic component further comprising an insulating layer covering at least a part of the conductive pattern and an upper pattern formed on the insulating layer.
An electronic component for high frequency signals comprising an insulating substrate, a dielectric layer formed over an entire surface of the insulating substrate and a conductive pattern formed on the dielectric layer, the dielectric layer being made from a sintered dielectric paste including a glass component and a ceramic constituent;
- wherein the conductive pattern has a dual structure including a first element and a second element, the second element of the conductive pattern covering the first element of the conductive pattern substantially entirely.
Dependencies are inferred from the claim text.