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US 6,477,016 B1Granted
Junction assembly of bonding pad and bump, and magnetic head device using the same
AssigneeAlps Electric Co., Ltd.
InventorsOoki Yamaguchi, Koichi Naito
Life of this patent
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Abstract
A bonding pad and a copper bump are bonded to each other by soldering. When the amount of Au melting into a soldering junction is not more than 9 percent by weight, the amounts of the precipitation of compounds of Au in the solder or on the surface thereof can be reduced and the bonding strength of the soldering junction can be enhanced.
Claims48
A junction assembly, comprising:
- a first conductive pattern;
- a bonding pad electrically coupled to the first conductive pattern;
- an Au film disposed on a surface of the bonding pad;
- a wiring member having a bump electrically coupled to a second conductive pattern;
- wherein the bonding pad and the bump are bonded together at a solder junction that has an Au content that is not more than 9 percent by weight.
2 more elements
Dependencies are inferred from the claim text.