Method for assembling a tiled, flat-panel microdisplay array
AssigneeRainbow Displays, Inc.
InventorsJ. Peter Krusius, Donald P. Seraphim
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Abstract
This invention describes fabrication techniques for producing microdisplays suitable for combining into tiled, flat-panel displays having visually imperceptible seams. Assembly techniques to overcome flatness requirements imposed by tiled, flat-panel display assemblies are also described. Edge treatment techniques for individual microdisplays while still part of the silicon die or wafer are also described. The use of these inventive techniques allows the assembly microdisplays into tiled, flat-panel that are appear visually seamless and optically uniform.
Claims60
A method for assembling a plurality of reflective microdisplay tiles into a tiled, flat-panel display, the projected image of which display having visually imperceptible seams in reflection, the steps comprising:
- a) providing a plurality of reflective monolithic microdisplay tiles, each tile having a front, active face, a rear, mounting face, at least one inner, precision finished edge, each of said microdisplay tiles comprising an array of pixels having a predetermined pixel pitch and having a semiconductor integrated circuit backplane embedded therein;
- b) laterally arranging said plurality of microdisplay tiles adjacent one another with said at least one inner, precision finished edge of a first one of said plurality of microdisplay tiles adjacent said at least one precision finished edge of a second one of said plurality of microdisplay tiles;
- c) releasably attaching said front, active faces of said plurality of microdisplay tiles to an optically flat carrier;
- d) after said laterally arranging step (b) and said releasably attaching step (c), applying a filling material to said rear faces of said plurality of tiles, if required, to fill any gaps between said inner, precision finished edges of said microdisplay tiles;
- e) after completing said releasably attaching step (c), polishing said rear, mounting face of each of said plurality of microdisplay tiles, if required;
- f) after completing said polishing step (e), attaching a common substrate to said rear, mounting faces of said plurality of microdisplay tiles;
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- g) after said attaching step (f), removing said plurality of microdisplay tiles from said optically flat carrier and polishing said front active faces of each of said plurality of microdisplay tiles to a precision of less than approximately 100 nM.
A method for assembling a plurality of reflective microdisplay tiles into a single, liquid crystal module, thereby forming a tiled, reflective microdisplay capable of generating a projected image having visually imperceptible seams, the steps comprising:
- a) providing a plurality of monolithically fabricated microdisplay tiles, each having a front, active face, a rear, mounting face, at least one precision finished edge, and a substantially rigid integrated circuit backplane, each of said microdisplay tiles comprising an array of pixel electrodes having a predetermined, substantially uniform pixel pitch, and having a thickness greater than said pixel pitch;
- b) laterally arranging said plurality of microdisplay tiles such that said at least one precision finished edge of a first one of said plurality of microdisplay tiles is adjacent said at least one precision finished edge of a second one of said plurality of microdisplay tiles, the distance between adjacent pixels proximate said precision finished edges being substantially equal to said predetermined, substantially uniform pixel pitch;
- c) vertically arranging said plurality of microdisplay tiles parallel to an optically flat common reference plane such that a space between said front, active face of each of said plurality of microdisplay tiles and said common reference plane is substantially equal for each of said plurality of microdisplay tiles, said spaces being smaller than the wavelength of visible light, said vertically arranging step (c) comprising the sub-steps:
- i) releasably attaching said front, active faces of said plurality of microdisplay tiles to an optically flat carrier;
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- ii) thereafter, when required, polishing said rear faces of said plurality of microdisplay tiles;
- d) after said vertically arranging step (c), attaching said rear, mounting faces of each of said plurality of microdisplay tiles to a common support substrate such that said lateral and vertical tile alignment is maintained, thereby forming a tiled microdisplay array;
- e) releasing said plurality of microdisplay tiles from said optically flat carrier;
- f) after said attaching step (d), polishing said front, active faces of each of said plurality of microdisplay tiles to a precision of less than approximately 100 nM;
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- (g) assembling said tiled microdisplay array into a tiled, reflective microdisplay assembly by adding a perimeter seal, liquid crystal and a common cover plate.
Dependencies are inferred from the claim text.