Stress-free socketed optical display package with die non-rigidly attached to containment structure

A support substrate device for use with a liquid crystal cell including a die having a pixel array, a plurality of die bond pads in electrical communication with the pixel array, and a transparent plate attached to the die, said substrate device comprising:

• substrate member defining a cavity formed and dimensioned for at least partial receipt of the liquid crystal cell therein, said substrate member being adapted to mount to said liquid crystal cell in a manner such that said die is substantially non-rigidly attached to said substrate member;
• a plurality of substrate bond pads positioned along a surface of said substrate member, said substrate bond pads being electrically coupled to respective die bond pads of said liquid crystal cell;
• a plurality of conductive contacts each at least partially embedded in said substrate member for secured support thereof, and configured to releasably couple to mating conductive contacts of an opposed electrical connector;
• and
• a plurality of circuit members embedded in said substrate member in a manner electrically connecting respective substrate bond pads to respective conductive contacts.

A liquid crystal display package comprising:

• a liquid crystal cell including a die having a pixel array, a transparent plate attached to the die, and a liquid crystal material disposed in a gap region between the die and the transparent plate;
• a containment structure adapted to at least partially receive liquid crystal cell therein, said liquid crystal cell being mounted to said containment structure in a manner such that said die is substantially non-rigidly attached to said containment structure;
• and
• an electrical connector portion integrated with said containment structure having a plurality of circuit portions embedded in said containment structure and associated conductive contacts each at least partially embedded in said containment structure for secured support thereof, said electrical connector portion being in substantially stress-free electrical connection with the pixel array, said conductive contacts further being configured to releasably couple to mating conductive contacts of an opposed electrical connector.

A liquid crystal display package comprising:

• a liquid crystal cell including a die having a pixel array, a transparent plate attached to the die, and a liquid crystal material disposed in a gap region between the die and the transparent plate;
• a containment structure adapted to at least partially receive liquid crystal cell therein, said liquid crystal cell being mounted to said containment structure in a manner such that said die is substantially non-rigidly attached to said containment structure;
• an electrical connector portion integrated with said containment structure having a plurality of conductive contacts each positioned in said containment structure for secured support thereof, and in substantially stress-free electrical connection with the pixel array, said conductive contacts further being configured to releasably couple to mating conductive contacts of an opposed electrical connector;
• and
• a plurality of spaced apart stabilizers arranged to couple edge portions of the liquid crystal cell to the substrate member without adhering a bottom surface of the die to a bottom surface of the substrate member.

A support substrate device for use with a liquid crystal cell including a die having a pixel array, a plurality of die bond pads in electrical communication with the pixel array, and a transparent plate attached to the die, said substrate device comprising:

• substrate member defining a cavity formed and dimensioned for at least partial receipt of the liquid crystal cell therein, said substrate member being adapted to mount to said liquid crystal cell in a manner such that said die is substantially non-rigidly attached to said substrate member;
• a plurality of substrate bond pads positioned along a surface of said substrate member, said substrate bond pads being electrically coupled to respective die bond pads of said liquid crystal cell;
• a plurality of conductive contacts each positioned in said substrate member for secured support thereof, and configured to releasably couple to mating conductive contacts of an opposed electrical connector;
• a plurality of circuit members in said substrate member in a manner electrically connecting respective substrate bond pads to respective conductive contacts;
• and
• a plurality of spaced apart stabilizers arranged to couple edge portions of the liquid crystal cell to the substrate member without adhering a bottom surface of the die to a bottom surface of the substrate member.