High frequency module

A structure for use in forming a high frequency module comprising:

• a substrate;
• a first array layer having a plurality of first elements arranged on one side of the substrate, each of said first elements having a pair of interconnection pattern portions connected thereto;
• a second array layer having a plurality of second elements arranged on the other side of the, substrate, each of said second elements having a pair of interconnection pattern portions connected thereto,
• wherein only one of the pair of interconnection pattern portions of the first array layer is connected to only one of the pair of interconnection pattern portions of the second array layer through the substrate therebetween;
• and
• a first and a second additional interconnection pattern arranged on each side of the substrate, respectively, for providing a desired circuit constant between said first and second array layers, the first and second additional interconnection patterns configured so as to only modify one or more of the interconnection pattern portions by creating additional interconnection portions, whereby some. first and second elements may be left idle.

A structure for use in forming a high frequency module comprising:

• a substrate;
• a first array layer having a plurality of first elements, each of said first elements having a pair of interconnection pattern portions that are arranged so that one of the interconnection portions overlaps its corresponding first element and the other is between the first element and the substrate;
• and
• a second array layer having a plurality of second elements, each of said second elements having a pair of interconnection pattern portions connected thereto, with each interconnection portion overlapping ends of its corresponding second element but separate from the other interconnection portion of the pair,
• wherein said first and second array layers are arranged in side-by-side relation on the same side of the substrate, but separated from one another along a horizontal plane on the substrate by a conductive film that is formed on a surface of a via hole in the substrate between adjacent first and second array layers;
• and
• an additional interconnection pattern for providing a desired circuit constant between said first and second array layers, the additional interconnection pattern configures so as to modifying only one or more of the interconnection patterns by creating additional interconnection portions.

A method for forming a high frequency module, comprising:

• providing a first passive element array layer including a plurality of first passive elements formed in an array;
• providing an electrical connection among said plurality of first passive elements by incorporating a first passive element interconnection pattern;
• providing a second passive element array layer including a plurality of second passive elements formed in an array;
• and
• providing electrical connection among said plurality of second passive elements by incorporating a second passive element interconnection pattern, wherein
• modifying only said first and second passive element interconnection patterns between said first and second passive element array layers in the high frequency module, by modifying any of the first or second passive element array layers and thereby obtaining a desired constant.

A method for forming a high frequency module comprising:

• providing a substrate;
• providing a first array layer having a plurality of first elements arranged on one side of the substrate;
• connecting a pair of interconnection pattern portions to each of said first elements;
• providing a second array layer having a plurality of second elements arranged on the other side of the substrate;
• connecting a pair of interconnection pattern portions to each of said second elements;
• wherein only one of the pair of interconnection pattern portions of the first array layer is connected to only one of the pair of interconnection pattern portions of the second array layer through the substrate therebetween;
• and
• configuring the structure so as to obtain a desired circuit constant by only modifying one or more of the interconnection patterns, and not any of the first or second elements or any other structure used in forming the high frequency module.

A method for forming a high frequency module comprising:

• providing a substrate;
• providing a first array layer having a plurality of first elements;
• providing a pair of interconnection pattern portions to each of said first elements that are arranged so that one of the interconnection portions overlaps its corresponding first element and the other is between the first element and the substrate;
• providing a second array layer having a plurality of second elements;
• connecting a pair of interconnection pattern portions to each of said second elements, with each interconnection portion overlapping ends of its corresponding second element but separate from the other interconnection portion of the pair;
• arranging said first and second array layers in a side-by-side relation on the same side of the substrate, but separated from one another along a horizontal plane on the substrate by a conductive film that is formed on a surface of a via hole in the substrate between adjacent first and second array layers;
• and
• configuring the structure so as to obtain a desired circuit constant by modifying only one or more of the interconnection patterns, and not any of the first or second elements or any other structure used in forming the high frequency module.