Method for testing signal paths between an integrated circuit wafer and a wafer tester

An apparatus for measuring resistance of signal paths within a interconnect structure for interconnecting ports of an integrated circuit (IC) tester with first test points arranged on an IC wafer to be tested, the apparatus comprising:

• a reference wafer similar in size and shape to said IC wafer to be tested, said reference wafer having thereon a plurality of second test points in an arrangement substantially similar to an arrangement of said first test points on said IC wafer,
• wherein said reference wafer further comprises circuit means for generating a test signal on said second test points, and
• wherein said test signal has an oscillating magnitude.

An apparatus for measuring resistance of signal paths within a interconnect structure for interconnecting ports of an integrated circuit (IC) tester with first test points arranged on an IC wafer to be tested, the apparatus comprising:

• a reference wafer similar in size and shape to said IC wafer to be tested, said reference wafer having thereon a plurality of second test points in an arrangement substantially similar to an arrangement of said first test points on said IC wafer,
• wherein said reference wafer further comprises circuit means for alternatively grounding said second test points and generating a test signal on said second test points in response to a control signal supplied as input to said reference wafer, and
• wherein said test signal has an oscillating magnitude.

An apparatus for measuring resistance of signal paths within a interconnect structure for interconnecting ports of an integrated circuit (IC) tester with first test points arranged on an IC wafer to be tested, the apparatus comprising:

• a reference wafer similar in size and shape to said IC wafer to be tested, said reference wafer having thereon a plurality of second test points in an arrangement substantially similar to an arrangement of said first test points on said IC wafer, and
• means coupled to said second points via the signal paths within said interconnect structure for measuring amplitudes of signals conveyed by the signal paths and for computing resistances of signal paths from the measured amplitudes of the signals.