Light emitting diode with improved heat dissipation

A light emitting diode having improved heat dissipation and comprising:

• a) a U-shaped middle connector having at least one connector extending therefrom, the U-shaped middle connector having a first width;
• b) a U-shaped middle plate having at least one connector extending therefrom, the U-shaped middle plate having a second width greater than the first width and located adjacent to, but spaced from the U-shaped middle connector, a width of the at least one connector extending therefrom being less than the second width of the U-shaped middle plate;
• c) a cup recess located completely within the second width of the U-shaped middle plate;
• d) a chip located within the cup recess;
• e) a wire connected to the chip and to the U-shaped middle connector;
• f) an insulation sealing material encapsulating the wire, the chip, the cup recess, at least a portion of the U-shaped middle connector such that the at least one connector is located exteriorly of the insulation sealing material, the insulation sealing material also encapsulating a portion of the U-shaped middle plate having at least said second width such that a portion of the U-shaped middle plate and the at least one connector extending therefrom extends exteriorly of the insulation sealing material to thereby improve heat dissipation;
• and,
• g) a support having a first portion attached to the U-shaped middle plate, the cup recess being formed in the first portion of the support, and having a second portion extending exteriorly of the insulation sealing material and acting as a heat dissipater.