Resin sealing method and resin sealing apparatus

A method of making a resin-sealed semiconductor product, comprising the following steps:

• a) providing a molding apparatus including a first mold with a first mold surface and a second mold with a second mold surface, wherein said first and second molds are selectively openable and closeable relative to each other with said first and second mold surfaces facing each other, and wherein said first mold surface has plural first mold cavities therein;
• b) providing a unitary semiconductor wafer including plural semiconductor chip areas adapted to form respective plural semiconductor chips by later dividing said wafer between said semiconductor chip areas, and having chip electrodes respectively on said semiconductor chip areas;
• c) providing a substrate arrangement having plural openings and plural substrate electrodes, selected from the group consisting of a single unitary substrate having said plural openings therein and said plural substrate electrodes thereon, and plural individual substrates each respectively having a respective one of said plural openings therein and at least a respective one of said substrate electrodes thereon;
• d) fixing said substrate arrangement onto said semiconductor wafer with said openings respectively in registration with said semiconductor chip areas, to form thereof an intermediate product;
• e) electrically connecting said chip electrodes with said substrate electrodes by metal conductors respectively extending between said chip electrodes and said substrate electrodes through said openings;
• f) arranging said intermediate product between said first and second molds with said semiconductor wafer facing said second mold surface and said substrate arrangement facing said first mold surface;
• g) closing said first and second molds relative to each other so that said first mold cavities are respectively in registration with individual ones or groups of said openings, and so that said metal conductors, said substrate electrodes and said openings are respectively received and enclosed in said first mold cavities;
• h) injecting molten resin into said first mold cavities and hardening said resin to encapsulate and seal said metal conductors, said substrate electrodes and said openings in said resin;
• and
• i) opening said first and second molds relative to each other and removing therefrom said intermediate product having said metal conductors, said substrate electrodes and said openings respectively encapsulated and sealed with said resin at each of said semiconductor chip areas.