Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

A semiconductor device comprising:

• a semiconductor element having a thickness of 200 μm or less, the semiconductor element having a first surface whereon circuitry is formed and a second surface;
• an electrode pad formed on said first surface of said semiconductor element;
• a conductive portion electrically connected to said electrode pad;
• and
• a sealing resin sealing said first surface of said semiconductor element;
• wherein parts of said conductive portion are exposed at a first surface of the sealing resin, wherein said second surface of said semiconductor element is in parallel with said parts of said conductive portion exposed at the first surface of the sealing resin, and wherein the sealing resin has a thickness greater than a half of the thickness of the semiconductor element.

A semiconductor device comprising:

• a semiconductor element having a thickness of 200 μm or less, the semiconductor element having a first surface on which an integrated circuit is formed and a second surface;
• an electrode pad formed on said first surface of said semiconductor element;
• a conductive portion electrically connected to said electrode pad;
• and
• a sealing resin sealing said first surface of said semiconductor element;
• wherein said sealing resin has a thickness greater than a half of said thickness of the semiconductor element.