Semiconductor chip, chip-on-chip structure device and assembling method thereof

A semiconductor chip for a chip-on-chip structure a plurality of semiconductor chips bonded to one another in a face-to-face stacked relation,

• wherein one of the plurality of semiconductor chips is a primary chip to be disposed with a front face thereof upward,
• wherein another of the plurality of semiconductor chips is a secondary chip to be bonded onto the primary chip with the front face thereof facing downward as opposed to the front face of the primary chip, and
• wherein each of the primary chip and the secondary chip is provided with a back mark, on a back face thereof, for recognition of orientation and electrode arrangement.

A semiconductor chip for a chip-on-chip structure comprising:

• a plurality of semiconductor chips bonded to one another in a face-to-face stacked relation,
• wherein a lead frame is fitted on a back face of the primary chip, and a back mark for recognition of orientation and electrode arrangement is provided in a predetermined position on the lead frame on the back face of the primary chip.