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US 6,476,485 B1Granted
Thin-film structure having reliably removable oxide layer formed on bump exposed at surface of insulating layer and manufacturing method therefor
AssigneeAlps Electric Co., Ltd.
InventorKiyoshi Sato
Life of this patent
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Abstract
In a thin-film structure, since a flat face of a bump, which is exposed at the surface of an insulating layer and is to be in contact with an electrode layer, is an exposed surface of a nickel layer, an oxide layer on the flat face can be reliably removed by using ion-milling or sputter etching.
Claims10
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein a thickness of the protective layer in an area other than the flat face of the bump is not less than 5 μm,
- wherein the electrically conductive material layer comprises one of a copper layer and a copper-containing layer, and the protective layer comprises one of a nickel layer and a nickel-containing layer,
- wherein a distance between the flat face of the protective layer and an uppermost surface of the electrically conductive material layer of the bump is 3 nm to 8 nm, and
- wherein an electrode layer electrically contacting the bump is formed on the flat face.
8 more elements
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein the electrically conductive material layer comprises one of a copper layer and a copper-containing layer, and the protective layer comprises one of a gold layer and a gold-containing layer formed on one of a nickel layer and nickel-containing layer, in which one of the nickel layer and the nickel-containing layer is present on the flat face, and
- wherein an electrode layer electrically contacting the bump is formed on the flat face.
6 more elements
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein the electrically conductive material layer comprises one of a copper layer and a copper-containing layer, and the protective layer comprises one of a gold layer and a gold-containing layer formed on one of a nickel layer and nickel-containing layer, in which one of the gold layer and the gold-containing layer is present on the flat face,
- wherein an electrode layer electrically contacting the bump is formed on the flat face, and
- wherein a thickness of the protective layer in an area other than the flat face of the bump is not less than 5 μm.
7 more elements
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein the electrically conductive material layer comprises one of a copper layer and a copper-containing layer, and the protective layer comprises one of a gold layer and a gold-containing layer formed on one of a nickel layer and nickel-containing layer, in which one of the gold layer and the gold-containing layer is present on the flat face,
- wherein an electrode layer electrically contacting the bump is formed on the flat face, and
- wherein a distance between the flat face of the protective layer and an uppermost surface of the electrically conductive material layer of the bump is 3 nm to 8 nm.
7 more elements
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein the electrically conductive material layer comprises one of a nickel layer and nickel-containing layer, and the protective layer comprises one of a gold layer and a gold-containing layer,
- wherein an electrode layer electrically contacting the bump is formed on the flat face, and
- wherein a thickness of the protective layer in an area other than the flat face of the bump is not less than 5 μm.
7 more elements
A thin-film magnetic head comprising:
- a thin film magnetic element having a lead layer;
- an electrically conductive layer connected to the lead layer;
- an insulating layer formed on the thin film element and the electrically conductive layer;
- and
- a bump formed on a surface of the electrically conductive layer, the bump being exposed at a surface of the insulating layer and an exposed surface of the bump being flush with the surface of the insulating layer to form a flat face;
- wherein the bump comprises an electrically conductive material layer and a protective layer covering a surface thereof and being composed of a material not as easily oxidized as the electrically conductive material layer,
- wherein the protective layer is the exposed surface of the bump that is flush with the surface of the insulating layer to form the flat face,
- wherein the electrically conductive material layer comprises one of a nickel layer and nickel-containing layer, and the protective layer comprises one of a gold layer and a gold-containing layer,
- wherein an electrode layer electrically contacting the bump is formed on the flat face, and
- wherein a distance between the flat face of the protective layer and an uppermost surface of the electrically conductive material layer of the bump is 3 nm to 8 nm.
7 more elements
Dependencies are inferred from the claim text.