High current capacity semiconductor device package and lead frame with large area connection posts and modified outline

A semiconductor device of increased current capacity without an increased size;

• said semiconductor device comprising a semiconductor device die;
• a plurality of bonding wires;
• a die mounting pad and a plurality of parallel spaced external conductors;
• at least one of said parallel spaced external conductors having a first bond wire post at one end thereof;
• the bottom of said die being fixed to the top surface of said die mounting pad;
• a plurality of said bonding wires being bonded at one end thereof to the top surface of said die and at the other end thereof to said bond wire post;
• a plastic housing for enclosing said die;
• said plurality of spaced conductors extending from the interior of said plastic housing, through a side wall of said housing to the exterior of said housing;
• the laterally outermost two of said plurality of spaced external conductors being reentrantly bent and penetrating said side wall of said housing so that said laterally outermost two conductors will have a greater spacing at said side wall than at their free ends thereby increasing the creepage distance along the surface of said side wall.