Semiconductor device and method of fabricating the same
AssigneeHitachi, Ltd.
InventorsYoshinori Miyaki, Kazunari Suzuki, Daisuke Omoda
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Abstract
A semiconductor device includes a semiconductor chip having a plurality of electrodes formed on a first major surface thereof, a resin package sealing the semiconductor chip therein, a plurality of leads electrically connected to the electrodes of the semiconductor chip and formed so as to extend inside and outside the resin package, and a support lead supporting the semiconductor chip at a part of a second major surface of the semiconductor chip opposite the first major surface. The semiconductor chip is bonded to the support lead with an adhesive tape.
Claims5
A resin molded semiconductor package, to be mounted on a printed circuit board by solder reflow, comprising:
- a semiconductor chip of silicon having a major surface and a rear surface opposite to said major surface, said semiconductor chip having a plurality of semiconductor elements and bonding pads formed on said major surface;
- a lead frame comprised of copper, said lead frame including:
- a first supporting lead and a second supporting lead for mounting said semiconductor chip, said first supporting lead extending in a first direction, said second supporting lead intersecting said first supporting lead and extending in a second direction which is different from said first direction, said first and second supporting leads being integrally formed each other;
- a plurality of leads each having an inner lead and an outer lead which is continuously formed with said inner lead, said plurality of leads being arranged to surround an intersecting portion of said first and second supporting leads;
- a plurality of bonding wires electrically connecting said inner leads of said plurality of leads with said plurality of bonding pads respectively;
- and
- a resin sealing body sealing said semiconductor chip, said inner leads of said plurality of leads, said first and second supporting leads and said plurality of bonding wires;
- wherein said semiconductor chip is mounted on said intersection of said first and second supporting leads,
- wherein an area where said first and second supporting leads overlap with said semiconductor chip is smaller than an area of, said semiconductor chip,
- wherein said semiconductor chip is adhered to said first and second supporting leads by an adhesive layer formed between said rear surface of said semiconductor chip and said intersecting portion of said first and second supporting leads,
- wherein said adhesive layer includes a base insulating film having upper and lower sides and adhesive formed on both the upper and lower sides of said base insulating film, and
- wherein a thermal expansion coefficient of said lead frame is larger than that of said semiconductor chip.
Dependencies are inferred from the claim text.