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US 6,476,475 B1Granted
Stacked SRAM die package
AssigneeAdvanced Micro Devices, Inc.
InventorMelissa Siow-Lui Lee
Life of this patent
Estimating the term…
Abstract
A circuit assembly is formed with a polyimide coated lower SRAM die and an upper die resin bonded to the SRAM die. The repair access opening in the polyimide coating on the upper surface of the SRAM die is filled with polyimide for protection before attaching the upper die to the SRAM die. Embodiments of the present invention including positioning a solid piece of polyimide within the repair access opening or spraying a thin coating of polyimide over the opening and on the first polyimide coating.
Claims20
A circuit assembly comprising:
- a substrate having a main surface;
- a first die having an upper surface and a lower surface attached to the main surface of the substrate, the first die comprising a first polyimide coating on the upper surface of the first die, the first polyimide coating having a repair access opening exposing a portion of the upper surface of the first die;
- a polyimide material, different from the first polyimide coating, over at least a portion of the opening;
- and
- a second die attached to the upper surface of the first die with the first polyimide coating and the polyimide material therebetween.
2 more elements
A method of manufacturing a circuit assembly, the method comprising:
- attaching a lower surface of a first die to a main surface of a substrate, the first die having an upper surface opposite a lower surface and a first polyimide coating on the upper surface of the first die, wherein the first polyimide coating has a repair access opening therein exposing a portion of an upper surface of the first die;
- covering at least part of the exposed upper portion of the first die with polyimide material;
- and
- attaching a second die to the upper surface of the first die with the first polyimide coating and the polyimide material therebetween.
1 more element
Dependencies are inferred from the claim text.