Integrated circuit package for mounting
AssigneeFujitsu Limited
InventorTatsuya Hirose
Life of this patent
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Abstract
In an integrated circuit package, a resistance film as an electric resistance part which is electrically independent is provided on a dielectric substrate at an opposed position to an integrated circuit chip. A thickness of the substrate is specified to be almost a quarter of a signal wavelength which is decided by a frequency used in an integrated circuit of the chip and the specific inductive capacity of the substrate, and the surface resistance value of the resistance film is specified to become equal to the characteristic impedance of air. Being structured as above, an unnecessary electromagnetic wave which is emitted from the integrated circuit of the integrated circuit chip is absorbed with extremely high efficiency, and stabilization of the operation of a circuit can be realized.
Claims20
An integrated circuit package comprising:
- a dielectric substrate having a rear surface with a grounding conductor and an upper surface with electric/electronic circuits including metallic film pattern;
- and
- an integrated circuit chip opposed to and connected with said dielectric substrate at the upper surface thereof,
- wherein said dielectric substrate has an electric resistance portion provided at the upper surface thereof, in an area opposed to said integrated circuit chip, that is electrically independent of said metallic film patterns.
An integrated circuit package comprising:
- a dielectric substrate having a rear surface with a grounding conductor and an upper surface with electric/electronic circuits including metallic film patterns;
- and
- an integrated circuit chip opposed to and connected with said dielectric substrate, wherein said dielectric substrate has an electric resistance portion, in an area opposed to said integrated circuit chip, that is electrically independent of said metallic film patterns, and
- the thickness of said dielectric substrate in said area is designed such that a predetermined signal wave to be absorbed by said electric resistance portion has its waveform open at the surface of said electric resistance portion.
Dependencies are inferred from the claim text.