Microwave integrated circuit multi-chip-module

A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line suited for transmitting microwave signals formed on the surface, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate and electromagnetically shielding the high frequency transmission line and each microwave integrated circuit form each other, wherein:

• and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein:
• the side surfaces of the module of the microwave integrated circuit module have external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.

A microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of high frequency circuit portions formed on the surface, a tubular waveguide part for guiding electromagnetic waves inputted to or outputted from the high frequency circuit portions and a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective high frequency circuit portions, the package substrate and the shielding member being bonded for electromagnetically shielding the high frequency circuit portions.

A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate of a co-fired ceramic of a dielectric property including a plurality of microwave circuit portions formed on the surface, a shielding member of a non-magnetic metal having plurality of recesses formed in position corresponding to the respective microwave circuit portions, the package substrate and a plurality of leadless chip carrier electrodes, the shielding member being bonded for electromagnetically shielding the high frequency circuit portions;

• and
• a receptacle having a plurality of flexible connector electrodes each connected to a corresponding leadless chip carrier electrode.

A mounting structure for mounting a microwave integrated circuit multi-chip-module comprising a package substrate having a high frequency transmission line formed on a surface of said substrate, a plurality of microwave integrated circuits mounted thereon, and a shielding member bonded to the surface of the package substrate for electromagnetically shielding the high frequency transmission line and each microwave integrated circuit from each other, and a mounting substrate with the microwave integrated circuit multi-chip-module mounted therein, wherein:

• the side surfaces of the package of the microwave integrated circuit module has external connection electrodes connected to the microwave integrated circuits, and the mounting substrate has a receptacle member with the microwave integrated circuit multi-chip-module mounted therein and having a flexible connector terminals connected to the external connection electrodes of the microwave integrated circuit multi-chip-module.