Arrangement of stacked, spherically-shaped semiconductors

A semiconductor device comprising:

• at least one set of four spherical members stacked in multiple stages, each of said four spherical members being connected to each of the other four spherical members, at least one of said four spherical members being formed of a semiconductor material and comprising at least one of a semiconductor element and wiring formed on a surface of said semiconductor material, and
• one of said four spherical members being arranged on an upper stage of said multiple stages and being in contact with and supported by the other three of said spherical members arranged on a lower stage,
• wherein said four spherical members includes a dummy spherical member that fills a gap formed between at least two other of said four spherical members when said dummy spherical member and said at least two other spherical members are stacked in said multiple stages, said dummy spherical member being formed without a semiconductor element on its surface.

A semiconductor device comprising:

• at least one set of four spherical members stacked in multiple stages, at least one of said plurality of spherical members being formed of a semiconductor material and comprising at least one of a semiconductor element and wiring formed on a surface of said semiconductor material,
• one spherical member of said at least one set arranged on an upper stage of said multiple stages and being in contact with and supported by the other three spherical members of said at least one set arranged on a lower stage, and
• at least one spherical member of said at least one set being a dummy spherical member that fills a gap formed between at least two other of said four spherical members when said dummy spherical member and said at least two other spherical members are stacked in said multiple stages, said dummy spherical member being formed without a semiconductor element on its surface.