Master-slice system semiconductor integrated circuit and design method thereof

A design method for designing a master slice semiconductor integrated circuit, having a placing and wiring method for a mater slice type semiconductor integrated circuit conducted by an automatic placing and routing apparatus with respect to a master slice having a plurality of basic cells formed in a matrix, in which first and second power source wirings that are formed along a first direction anti traverse the plurality of basic cells connected to a plurality of signal wirings that are formed along the first direction or a second direction that traverses the first direction to provide connectons within each of the plurality of basie cells and/or between the plurality of basic cells, the design method comprising:

• a first step of registering, in the automatic placing and routing apparatus that defines the first direction or the second direction as a priority wiring direction for each of layers in which the wirings are formed, definitions of effective pin positions that connect the plurality of signal wirings, the plurality of first and second power source wirings, and the plurality of basic cells;
• a second step of registering a net list that defines connections among the plurality of basic cells in the automatic placing and routing apparatus;
• and
• a third step of determining placement of actual pin positions and wiring routes for the first and second power source wirings and the plurality of signal wirings, based on data of the definitions of the effective pin positions and the net list,
• wherein the first step includes the step of defining the effective pin positions inside and outside a region between the first power source wiring and the second power source wring, in a region corresponding to one of a plurality of component layers with which transistors of the plurality of basic cells are formed, and on lattice grids along which the plurality of basic cells are formed, and
• wherein the third step includes the step of connecting one of the plurality of component layers and two of the plurality of signal wirings at determined pin positions, in which the two of the plurality of signal wirings are connected by the one component layer.