Wafer scale processing
AssigneeThree-Five Systems, Inc.
InventorsTobias W. Walker, Douglas J. McKnight, Kam Wan
Life of this patent
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Abstract
This invention relates to a method of fabricating a light modulation system having a semiconductor substrate. In one exemplary method, an optical layer is applied over a semiconductor substrate which includes a plurality of integrated circuits. Each of these integrated circuits is capable of creating a separate display device. A protective layer is then applied over the optical layer. The plurality of integrated circuits is then singulated. Various other embodiments of apparatuses and methods are disclosed.
Claims41
An apparatus on a semiconductor substrate comprising:
- a semiconductor wafer containing a plurality of integrated circuits, each of which is for creating a separate display device after singulation from the semiconductor wafer;
- a first glass substrate attached to said silicon wafer;
- at least one optical element layer attached over said first glass substrate;
- and
- a second glass substrate attached over said first glass substrate.
A display device apparatus comprising:
- a semiconductor integrated circuit (IC) device;
- an electro-optic layer operatively coupled to said semiconductor IC device;
- a first glass substrate attached to said semiconductor integrated circuit device;
- at least one optical element layer attached over said first glass substrate;
- and
- a second glass substrate attached over said at least one optical element layer.
The apparatus of claim 34 wherein said first adhesive layer and said second adhesive layer comprise urethane.
Dependencies are inferred from the claim text.