Backside light emitting chip type light emitting element and insulating substrate therefor
AssigneeRohm Co., Ltd.
InventorHiroki Ishinaga
Life of this patent
Estimating the term…
Abstract
A backside light emitting chip type light emitting element having at least three internal electrodes and at least three external electrodes electrically connected to the internal electrodes respectively on one principal surface of an insulating substrate, and at least two light emitting chips connected to the internal electrodes. The light emitting chips may emit light of different colors, respectively.
Claims7
A backside light emitting chip type light emitting element for use with a wiring substrate having a facially-opposing pair of wiring substrate surfaces, comprising:
- an insulating substrate defining an insulating substrate surface,
- at least three internal electrodes formed on one principal surface of the insulating substrate,
- at least three external electrodes, formed on the one principal surface of the insulating substrate, which are electrically connected to the at least three internal electrodes, respectively, and
- at least two light emitting chips connected to the internal electrodes, wherein the light emitting element is bonded on one wiring substrate surface and emits light towards the other wiring substrate surface and the at least three internal electrodes have respective bonding surfaces bonded onto the insulating substrate surface where the at least two light emitting chips are bonded.
An insulating substrate used for a backside light emitting chip type light emitting element and a wiring substrate having a facially-opposing pair of wiring substrate surfaces, in which
- at least three internal electrodes and at least three external electrodes connected to the internal electrodes, respectively, are formed on one principal surface of the insulating substrate, and
- the external electrodes are formed on a peripheral section side of the one principal surface of the insulating substrate with respect to the internal electrodes wherein the light emitting element is bonded on one wiring substrate surface and emits light towards the other wiring substrate surface and the at least three internal electrodes have respective bonding surfaces bonded onto the principal surface of the insulating substrate where the light emitting element is bonded.
Dependencies are inferred from the claim text.