Compact optical measuring module utilizing three dimensional construction
AssigneeJohannes Heidenhain GmbH
InventorReiner Burgschat
Life of this patent
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Abstract
A three-dimensional measuring module includes an optical chip arranged spatially above a scanning plate and a signal processing assembly arranged above the optical chip. A housing completely encloses the optical chip and the signal processing assembly as well as a scanning plate. The electrical connecting lines between the optical chip and the signal processing assembly are routed via the scanning plate and the interior side of the housing to the signal processing assembly. The output signals of the signal processing assembly are conveyed via connecting lines to contacts on the exterior side of the housing. The conductive lines between the optical chip and the signal processing assembly can be kept very short, so that line resistance and interference coupling are reduced.
Claims14
A three-dimensional measuring module, comprising:
- a scanning plate;
- an optoelectronic assembly disposed over the scanning plate;
- a signal processing unit disposed over the optoelectronic assembly, the signal processing unit and the optoelectronic assembly being separate units;
- first electrical conductive lines disposed on the protective cap and on the scanning plate, said first lines connecting the optoelectronic assembly to the signal processing unit;
- second electrical conductive lines disposed in the protective cap, said second lines connecting output signal contacts of the signal processing unit to contacts disposed on an exterior portion of the protective cap;
- and
- a protective cap cooperating with the scanning plate to substantially enclose the optoelectronic assembly and the signal processing unit.
A three-dimensional measuring module, comprising:
- a scanning plate;
- an optoelectronic assembly disposed over the scanning plate;
- a signal processing unit disposed over the optoelectronic assembly;
- a protective cap cooperating with the scanning plate to substantially enclose the optoelectronic assembly and the signal processing unit;
- first electrical conductive lines disposed on the protective cap and on the scanning plate, said first lines connecting the optoelectronic assembly to the signal processing unit;
- and
- second electrical conductive lines disposed in the protective cap, said second lines connecting output signal contacts of the signal processing unit to contacts disposed on an exterior portion of the protective cap.
Dependencies are inferred from the claim text.