Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
AssigneeHewlett-Packard Company
InventorsMohammad Akhavain, Say-Teng Lai, Robert-Scott Melendrino Lopez
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Abstract
The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.
Claims12
A method of performing optical fiber push laser bonding operations on electric conductor leads, comprising:
- providing an optical fiber push laser bonding system having an optical fiber for directing a laser beam;
- performing laser bonding operations with said bonding system;
- generally concurrently with the laser bonding operations, examining the mechanical integrity of the fiber;
- and
- analyzing the condition of the optical fiber in order to determine the need for corrective action.
A method of bonding operations electric conductor leads, comprising the steps of:
- using an optical fiber to push together electrical conductor leads to be bonded;
- directing a laser beam through the fiber, while the fiber is pushing the leads together, to form a bond between the leads;
- interrupting the using and directing steps;
- monitoring the fiber condition during said interrupting of the using and directing steps;
- and
- if said monitoring indicates a high probability of said bond being weak, then repairing or replacing the fiber.
Dependencies are inferred from the claim text.