Conductor systems for thick film electronic circuits
AssigneeVisteon Global Technologies, Inc.
InventorDongkai Shangguan
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Abstract
A thick film electronic circuit is disclosed. The circuit includes a substrate for supporting the circuit and a conductive trace for interconnecting a plurality of electronic devices dispersed on the thick film electronic circuit. The conductive trace includes a bonding pad for interconnecting at least one of the plurality of electronic devices to the conductive trace using solder. Moreover, the conductive trace is comprised of palladium silver and the bonding pad is comprised of silver completely covered with solder.
Claims19
A thick film electronic circuit, comprising:
- a substrate for supporting the circuit;
- and
- a conductive trace for interconnecting a plurality of electronic devices dispersed on the thick film electronic circuit, and
- wherein the conductive trace includes a bonding pad for interconnecting at least one of the plurality of electronic devices to the conductive trace, and
- wherein the conductive trace is comprised of palladium silver and the bonding pad is comprised of silver.
A method for interconnecting an electronic device to a thick film electronic circuit, the method comprising:
- supporting the electronic circuit using a substrate;
- creating a plurality of conductive traces on the substrate to interconnect a plurality of electronic devices, wherein the plurality of conductive traces have a plurality of bonding pads for attaching the devices thereto;
- depositing a solder paste onto the bonding pads;
- placing at least one of the plurality electronic devices to the bonding pads having the solder paste deposited thereon;
- and
- reflowing the solder paste to form an interconnect between the device and the bonding pad.
Dependencies are inferred from the claim text.