Printed circuit board for semiconductor package and method for manufacturing the same

A semiconductor package comprising:

• a substrate having a first surface, a layer of metal circuit patterns on the first surface, each said circuit pattern having a planar outer surface parallel to the first surface, a peripheral side surface entirely around the circuit pattern and extending between the planar outer surface of the circuit pattern and the first surface, and a bond finger at an inner end of the circuit pattern, wherein the planar outer surface of the circuit pattern at the bond finger is covered by a layer of a plating metal, and a remaining portion of the planar outer surface of the circuit pattern outward of the bond finger and the peripheral side surface of the circuit pattern are devoid of the plating metal;
• a layer of a solder mask coated on the first surface and the circuit patterns excluding the bond fingers;
• a semiconductor chip coupled to substrate;
• and
• a plurality of electrical conductors each electrically connected between the semiconductor chip and the layer of the plating metal at the bond finger of a respective one of the circuit patterns.

A semiconductor package comprising:

• a substrate having a first surface with a layer of metal circuit patterns thereon, said circuit patterns being entirely inward of a perimeter of the substrate, each said circuit pattern having a planar outer surface parallel to the first surface, a peripheral side surface entirely around the circuit pattern and extending between the planar outer surface of the circuit pattern and the first surface, and a bond finger at an inner end of the circuit pattern,
• wherein the planar outer surface of the circuit pattern at the bond finger is covered by a layer of a plating metal, and a remaining portion of the planar outer surface of the circuit pattern outward of the bond finger and the peripheral side surface of the circuit pattern are devoid of the plating metal;
• a layer of a solder mask on the first surface and the circuit patterns excluding the respective bond fingers;
• a semiconductor chip coupled to the substrate;
• and
• a plurality of bond wires each electrically connected between the semiconductor chip and the layer of the plating metal at the bond finger of the respective circuit patterns.

A method of manufacturing a printed circuit board for a semiconductor package, comprising the steps of:

• providing a substrate having a first surface;
• and
• forming a layer of metal circuit patterns on the first surface, said circuit patterns being entirely inward of a perimeter of the substrate, each said circuit pattern having a planar outer surface parallel to the first surface, a peripheral side surface entirely around the circuit pattern and extending between the planar outer surface of the circuit pattern and the first surface, and a bond finger at an inner end of the circuit pattern,
• wherein the planar outer surface of the circuit pattern at the bond finger is covered by a layer of a plating metal, and a remaining portion of the planar outer surface of the circuit pattern outward of the bond finger and the peripheral side surface of the circuit pattern are devoid of the plating metal.

A method of manufacturing a semiconductor package, comprising the steps of:

• providing a substrate having a first surface with a layer of metal circuit patterns thereon, each said circuit pattern having a planar outer surface parallel to the first surface, a peripheral side surface entirely around the circuit pattern and extending between the planar outer surface of the circuit pattern and the first surface, a bond finger at an inner end of the circuit pattern, wherein the planar outer surface of the circuit pattern at the bond finger is covered by a layer of a plating metal, and a remaining portion of the planar outer surface of the circuit pattern outward of the bond finger and the peripheral side surface of the circuit pattern are devoid of the plating metal, and a layer of a solder mask on the first surface and the circuit patterns excluding the bond fingers;
• and
• coupling a semiconductor chip to the substrate;
• providing a plurality of electrical conductors, and electrically connecting each of said electrical conductors between the semiconductor chip and the layer of the plating metal at the bond finger of a respective one of the circuit patterns.