Wiring substrate and process for producing the same
AssigneesSanyo Electric Co., Ltd., Oki Electric Industry Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Hitachi, Ltd., Fujitsu Limited, Matsushita Electronics Corporation, Mitsubishi Denki Kabushiki Kaisha, Rohm Co., Ltd., Kanji Otsuka, Tamotsu Usami
InventorsKanji Otsuka, Tamotsu Usami
Life of this patent
Estimating the term…
Abstract
Signal wirings 22, 23 are formed on a pair of substrates 20, 21, and the substrates are joined together through an insulating layer 24 so that the signal wirings 22, 23 are placed in parallel and facing to each other. The surfaces of the overlapping faces of the signal wirings 22, 23 are made smooth, and the roughness of the same surfaces is smaller than the skin depth δs due to the skin effect, preferably less than one third, for minimizing the increase in the electric resistance due to the skin effect.
Claims5
A wiring substrate comprising:
- one or a plurality of first signal wirings formed on a primary plane of a first substrate;
- one or a plurality of second signal wirings formed on a primary plane of a second substrate;
- and
- an insulating material inserted between said primary plane of said first substrate and said primary plane of said second substrate;
- wherein said first and said second signal wirings are placed in parallel facing to each other to create a signal wiring pair and are configured to receive a pair of complementary signals.
A wiring substrate, comprising:
- one or a plurality of first signal wirings formed on a primary plane of a first substrate;
- one or a plurality of second signal wirings formed on a primary plane of a second substrate;
- and
- an insulating material inserted between said primary plane of said first substrate and said primary plane of said second substrate;
- wherein said first and said second signal wirings are placed in parallel facing to each other to create a signal wiring pair,
- wherein the surface roughness of surfaces of overlapping faces of said first and said second signal wirings is smaller than a skin depth of a skin effect caused by supplying high frequency signals to said signal wiring pair.
Dependencies are inferred from the claim text.