Joining method of covered wire, and covered wire with low-melting-point metal layer therein

A joining method for electrically conductively connecting first and second members together, comprising:

• providing the first member comprising a covered wire having a conductor wire portion and a covering portion covering an outer periphery of the conductor wire portion, the conductor wire portion of the covered wire comprising a plurality of elemental-wire congregations, each elemental-wire congregation having a plurality of elemental wires and a low-melting-point metal layer covering around the elemental wires and connecting the elemental wires to each other;
• providing the second member having a conductive portion;
• pinching connection portions of the first and second members between resinous chips;
• pressurizing and heating the connection portions of the first and second members;
• eliminating the covering portion corresponding to the connection portion of the first member;
• welding the elemental wires of the first member and the conductive portion of the second member by melting the low-melting-point metal layer;
• and
• hermetically sealing the connection portions of the first and second members by welding the resinous chips to each other.