Solar cell and method for fabricating the same
AssigneeSharp Kabushiki Kaisha
InventorKenzo Kawano
Life of this patent
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Abstract
A solar cell including a semiconductor substrate of a first conductive type; a first region of a second conductive type provided on a surface of the substrate; and a bypass function region including a second region of a second conductive type provided on the surface of the substrate and spaced a predetermined distance from the first region, and a third region for setting the substrate and the second region at the same potential; wherein when a reverse voltage is applied between the substrate and the first region, the bypass function region forms a bypass circuit between the substrate and the first region using a depletion layer formed inside the substrate by the reverse voltage.
Claims14
A solar cell comprising:
- a semiconductor substrate of a first conductive type;
- a first region of a second conductive type provided on a surface of the substrate;
- and
- a bypass function region including a second region of the second conductive type provided on the surface of the substrate and spaced from the first region so that the first and second regions of the second conductive type do not contact one another, and a third region for setting the substrate and the second region at the same potential;
- wherein when a reverse voltage is applied between the substrate and the first region, the bypass function region forms a bypass circuit between the substrate and the first region using a depletion layer formed inside the substrate by the reverse voltage so that a punch through current flows through the depletion layer between the first and second regions of the second conductive type.
A solar cell comprising:
- a semiconductor substrate of a first conductive type;
- a first region of a second conductive type provided on a surface of the substrate at least partially in a photoreceptive portion of the solar cell;
- bypass means for performing a bypass function, the bypass means including a second region of the second conductive type provided on the surface of the substrate and spaced from the first region so that the first and second regions of the second conductive type do not contact one another;
- and
- the bypass means further setting the substrate and the second region at the same potential so that when a reverse voltage is applied between the substrate and the first region, the bypass means forms a bypass circuit between the substrate and the first region using a depletion layer formed inside the substrate by the reverse voltage so that a punch through current flows through the depletion layer between the first and second regions of the second conductive type.
Dependencies are inferred from the claim text.