One-pack composition of epoxy resin(s) with no oh groups and ketimine

A one-pack epoxy resin composition comprising:

• a ketimine compound;
• and (1) an epoxy resin consisting essentially of a bisphenol A polyglycidyl ether epoxy resin or a bisphenol F polyglycidyl ether epoxy resin, where in each the content of epoxy resin having no hydroxyl groups in the molecule is more than 95 mol %, or (2) an epoxy resin containing (a) a bisphenol A polyglycidyl ether epoxy resin or a bisphenol F polyglycidyl ether epoxy resin, where in each the content of epoxy resin having no hydroxyl groups in the molecule is more than 95 mol % and (b) an epoxy-resin having hydroxyl groups capped by a reaction of hydroxyl groups in the molecule with a capping compound to thus modify the hydroxyl groups, wherein the total amount of epoxy resins (a) and (b) is more than 95 mol % of the total epoxy resin (2);
• and wherein, each of epoxy resins (1) or (2), have a content of epoxy resin having hydroxyl groups in the molecule which is 0 to less than 5 mol % of the total epoxy resin (1) or (2).