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US 6,475,966 B1Granted
Plasma etching residue removal
AssigneeShipley Company, L.L.C.
InventorJavad J. Sahbari
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Abstract
Disclosed are compositions useful for the removal of plasma etching polymeric residue from substrates, such as electronic devices. Also disclosed are methods of removing such plasma etching polymeric residue.
Claims5
A composition for the removal of plasma etching polymeric residue from a substrate comprising:
- 75 to 77.5% dimethyl sulfoxide;
- 2.5% tetramethylammonium hydroxide;
- 15 to 17.5% hydroxylamine;
- and 5% of a corrosion inhibitor selected from the group consisting of t-butylcatechol and benzotriazole.
1 more element
Dependencies are inferred from the claim text.