Semiconductor device and method of forming semiconductor device
AssigneeSeiko Instruments Inc.
InventorTakashi Hosaka
Life of this patent
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Abstract
A semiconductor device, such as an IC package, having the same size as an IC chip and having improved qualities is manufactured at a low cost by a particular manufacturing method. The semiconductor device has stepped-projection bumps bonded to electrode pads on a semiconductor substrate in which a semiconductor element is formed. A column portion and a portion in a horizontal portion of each stepped-projection bump are exposed while the other portion of the bump is covered with a protective material. When windows of the protective material corresponding to the column portions are formed, the windows are patterned by using a masking material based on a photoetching method, and the protective material is removed by etching.
Claims9
A method of manufacturing a semiconductor device, comprising the steps of:
- forming a semiconductor element in a semiconductor substrate;
- bonding a bump having a straight column extending therefrom to an electrode pad of the semiconductor element so that the column extends upward from the semiconductor element;
- applying a protective material to cover and protect the semiconductor element and the bump;
- partially removing the protective material to expose the column and a portion of the bump surrounding the column;
- mounting the semiconductor element having the straight column on a mount substrate;
- and
- electrically connecting the bump to a conductor on the mount substrate.
A method of manufacturing a semiconductor device, comprising the steps of:
- forming a semiconductor element in a semiconductor substrate;
- bonding a bump having a straight column extending therefrom to an electrode pad of the semiconductor element so that the column extends upward from the semiconductor element;
- applying a protective material to cover and protect the semiconductor element and the bump;
- partially removing the protective material to expose the column;
- mounting the semiconductor element having the straight column on a mount substrate;
- and
- electrically connecting the bump to a conductor on the mount substrate.
A method of manufacturing a packaged semiconductor device, comprising the steps of:
- forming a semiconductor element in a semiconductor substrate, the semiconductor element having a bonding pad for external connection;
- performing a wire bonding process to form a metallic bump on the bonding pad with a straight wire extending from the metallic bump away from the semiconductor element;
- cutting the wire so that the wire may serve as an external connection lead;
- forming a protective film to cover the semiconductor element and the metallic bump;
- partially removing the protective film to expose the wire extending from the bump, so that the semiconductor substrate and the protective film serve as a package of the semiconductor element and the wire serves as an external connection lead for the packaged semiconductor element;
- mounting the packaged semiconductor element having the straight column on a mount substrate;
- and
- electrically connecting the bump to a conductor on the mount substrate.
Dependencies are inferred from the claim text.